ENDORFY Pactum 4 4G EY0C004 Thermal Paste 4g Right Top Angle View
ENDORFY Pactum 4 4G EY0C004 Thermal Paste 4g Right Top Angle View
ENDORFY Pactum 4 4G EY0C004 Thermal Paste 4g Right Top Angle View

Pactum 4 4g Thermal Paste

29,00 zł
29,00 zł
Lowest price in the last 30 days: 29,00 zł

ENDORFY Pactum 4 is a thermal paste designed for the most demanding components. It effectively dissipates heat from modern processors, supporting their stable, long-term operation – even under heavy load. 

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You can find the warranty terms HERE.

Cooling Sp. z o.o.
Sokołowska 24
05-806 Sokołów
Poland

SKU: EY0C004

EAN: 5903018666365

ENDORFY Pactum 4 4G EY0C004 Thermal Paste 4g Right Top Angle View

Key features of the Pactum 4 4 g thermal paste

ENDORFY Pactum 4 4 EY0C004-Thermal Compounds Thermal Paste Processor
ENDORFY Pactum 4 – szczelne wypełnienie powierzchni kontaktowej procesora
ENDORFY Pactum 4 – pasta termoprzewodząca nałożona na procesor
Aplikacja pasty termoprzewodzącej Endorfy Pactum 4 za pomocą dołączonej łopatki

Effective processor cooling

Keeps high-end processors at safe temperatures even during intensive gaming sessions.

Excellent filling of surface irregularities

Seals microscopic gaps between the IHS and the cooler, ensuring maximum heat transfer and a stable connection.

Simple and quick application

Only a small amount of paste is needed – a single dot or a thin line applied directly to the processor.

Convenient applicator included

Quickly and easily spread the paste over the processor surface using the included spatula.

Discover the capabilities of Pactum 4 4 g

ENDORFY Pactum 4 – pasta termoprzewodząca nałożona na procesor

Effective CPU cooling

Modern processors can generate huge amounts of heat. Pactum 4 efficiently transfers it to the heatsink or radiator, helping keep components within a safe temperature range – even during intensive computations and long gaming sessions. The paste’s formula retains its properties for a long time, providing stable cooling for years and reducing the need for frequent replacement.

ENDORFY Pactum 4 – szczelne wypełnienie powierzchni kontaktowej procesora

Excellent filling of surface irregularities

The paste precisely fills the microscopic gaps between the processor’s IHS and the base of air cooling or liquid cooling. It forms a uniform, sealed layer that maximizes heat transfer and allows components to operate at full performance. Its formula adheres excellently to surfaces, remaining stable for a long time. It does not run, does not dry out, and maintains its properties even during intensive use.

Aplikacja pasty termoprzewodzącej Endorfy Pactum 4 za pomocą dołączonej łopatki

Simple and quick application

Applying Pactum 4 is extremely intuitive. You only need a small amount of paste – a dot or a thin line – applied directly to the processor. If you care about a perfectly even layer, use the included spatula – the whole process takes a few dozen seconds and doesn’t require experience. After installing the cooler, the paste starts working immediately, providing optimal thermal conditions from the first startup.

Key features you'll love about Pactum 4 4 g

Long-lasting thermal performance

Ideal for processors

Excellent filling of surface irregularities

Fast and easy application

Convenient applicator included

4 g capacity – enough for more than one installation

Product dimensions for Pactum 4 4 g

Technical specification Pactum 4 4g Thermal Paste

Technical specifications

Density g/cm³ 2.6
Warranty months 24
Thermal conductivity W/(m·K) 12
Product type thermal paste
Weight [g] 4

Package contents

Pactum 4 thermal paste 4 g
Spatula
User manual

Downloads

EY0C004_Pactum-4-4g-EN.d20251001-u080021.zip

Instructions

Pactum 4 4 g (EY0C004)

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