ENDORFY Pactum 1 4G EY0C001 Thermal Paste 4g Right Top Angle View
ENDORFY Pactum 1 4G EY0C001 Thermal Paste 4g Right Top Angle View
ENDORFY Pactum 1 4G EY0C001 Thermal Paste 4g Right Top Angle View

Pactum 1 4g Thermal Paste

15,00 zł
15,00 zł
Lowest price in the last 30 days: 15,00 zł

ENDORFY Pactum 1 is a thermal paste designed for demanding components. It effectively dissipates heat from modern processors, supporting their stable, long-term operation – even under intensive load.

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You can find the warranty terms HERE.

Cooling Sp. z o.o.
Sokołowska 24
05-806 Sokołów
Poland

SKU: EY0C001

EAN: 5903018666334

ENDORFY Pactum 1 4G EY0C001 Thermal Paste 4g Right Top Angle View

Key features of the Pactum 1 4 g thermal paste

ENDORFY Pactum 1 4 EY0C001-Thermal Compounds Thermal Paste Processor
ENDORFY Pactum 1 – szczelne wypełnienie powierzchni kontaktowej procesora
ENDORFY Pactum 1 – pasta termoprzewodząca nałożona na procesor
Aplikacja pasty termoprzewodzącej Endorfy Pactum 1 za pomocą dołączonej łopatki

Effective CPU cooling

Keeps the processor at safe temperatures even during intense gaming sessions.

Excellent filling of surface irregularities

Seals microscopic gaps between the IHS and the cooler, ensuring maximum heat transfer and a stable connection.

Simple and quick application

Only a small amount of paste is needed – a single dot or a thin line applied directly to the processor.

Convenient spatula included

Quickly and easily spread the paste over the processor surface using the included spatula.

Discover the capabilities of Pactum 1 4 g

ENDORFY Pactum 1 – pasta termoprzewodząca nałożona na procesor

Effective CPU cooling

Modern processors can generate huge amounts of heat. Pactum 1 efficiently transfers it to the heatsink or radiator, helping keep components within a safe temperature range – even during intensive computations and long gaming sessions. The 4 g capacity is enough for dozens of applications, and thanks to its efficient formula, the paste retains its properties for a long time, providing stable cooling for years and reducing the need for frequent replacement.

ENDORFY Pactum 1 – szczelne wypełnienie powierzchni kontaktowej procesora

Excellent filling of surface irregularities

The paste precisely fills microscopic gaps between the CPU IHS and the base of air cooling or liquid cooling. It creates a uniform, sealed layer that maximizes heat transfer and allows components to run at full performance. Its formula adheres perfectly to surfaces, remaining stable for a long time. It does not run, does not dry out, and retains its properties even under intensive use.

Aplikacja pasty termoprzewodzącej Endorfy Pactum 1 za pomocą dołączonej łopatki

Simple and quick application

Applying Pactum 1 is extremely intuitive. Just a small amount of paste – a dot or a thin line – applied directly to the processor. If you want a perfectly even layer, use the included spatula – the whole process takes only a few dozen seconds and doesn’t require experience. After mounting the cooler the paste starts working immediately, providing optimal thermal conditions from the first startup.

Features you'll love about the Pactum 1 4 g

Efficient formula — enough for dozens of applications

Ideal for processors

Excellent filling of surface irregularities

Fast and easy application

Convenient applicator included

Product dimensions for Pactum 1 4 g

Technical specification Pactum 1 4g Thermal Paste

Technical specifications

Density g/cm³ 2.5
Warranty months 24
Thermal conductivity W/(m·K) 4
Product type thermal paste
Weight [g] 4

Package contents

Pactum 1 thermal paste 4 g
Spatula
User manual

Downloads

EY0C001_Pactum-1-4g-EN.d20251001-u080018.zip

Instructions

Pactum 1 4 g (EY0C001)

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