ENDORFY Pactum 1 25G EY0C002 Thermal Paste 25g Right Top Angle View
ENDORFY Pactum 1 25G EY0C002 Thermal Paste 25g Right Top Angle View
ENDORFY Pactum 1 25G EY0C002 Thermal Paste 25g Right Top Angle View

Pactum 1 25g Thermal Paste

29,00 zł
29,00 zł
Lowest price in the last 30 days: 29,00 zł

ENDORFY Pactum 1 is a thermal paste designed for demanding components. It effectively dissipates heat from modern processors, supporting their stable, long-term operation – even under intensive load. The 25 g capacity allows for many applications, letting you service your system for a long time without needing a new tube.

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You can find the warranty terms HERE.

Cooling Sp. z o.o.
Sokołowska 24
05-806 Sokołów
Poland

SKU: EY0C002

EAN: 5903018666341

ENDORFY Pactum 1 25G EY0C002 Thermal Paste 25g Right Top Angle View

Key features of the Pactum 1 25g thermal paste

ENDORFY Pactum 1 – pasta termoprzewodząca nałożona na procesor
ENDORFY Pactum 1 – szczelne wypełnienie powierzchni kontaktowej procesora
Aplikacja pasty termoprzewodzącej Endorfy Pactum 1 za pomocą dołączonej łopatki

Effective CPU cooling

Keeps top-tier processors at safe temperatures even during intense gaming sessions.

Excellent filling of irregularities

Tightly fills the microscopic gaps between the IHS and the cooler, ensuring maximum heat transfer and a stable connection.

Simple and quick application

Only a small amount of paste is needed – a single dot or a thin line applied directly to the CPU.

Convenient applicator included

Quickly and easily spread the paste over the CPU surface using the included applicator.

Discover the capabilities of Pactum 1 25g

ENDORFY Pactum 1 – pasta termoprzewodząca nałożona na procesor

Effective CPU cooling

Modern processors can generate huge amounts of heat. Pactum 1 efficiently transfers it to the heatsink or radiator, helping keep components within a safe temperature range – even during intensive computations and long gaming sessions. The 25 g capacity lasts for many years and even more applications, making Pactum 1 an ideal choice for both individual users and PC service centers. Its efficient formula ensures the paste retains its properties for a long time, providing stable cooling and reducing the need for frequent replacement.

ENDORFY Pactum 1 – szczelne wypełnienie powierzchni kontaktowej procesora

Excellent filling of irregularities

The paste precisely fills the microscopic gaps between the processor’s IHS and the base of air cooling or liquid cooling. It forms a uniform, sealed layer that maximizes heat transfer and allows components to operate at full performance. Its formula adheres excellently to surfaces, remaining stable for a long time. It does not run, does not dry out, and maintains its properties even during intensive use.

Aplikacja pasty termoprzewodzącej Endorfy Pactum 1 za pomocą dołączonej łopatki

Simple and quick application

Applying Pactum 1 is extremely intuitive. Just a small amount of paste – a dot or a thin line – applied directly to the processor. If you want a perfectly even layer, use the included spatula – the whole process takes only a few dozen seconds and doesn’t require experience. After mounting the cooler the paste starts working immediately, providing optimal thermal conditions from the first startup.

Features you'll love about the Pactum 1 25g

Long-lasting thermal performance

Efficient formula — enough for dozens of applications

Ideal for processors

Excellent filling of surface irregularities

Fast and easy application

Convenient applicator included

Large 25 g capacity — stock to last for years

Product dimensions for Pactum 1 25 g

Technical specification Pactum 1 25g Thermal Paste

Technical specifications

Density g/cm³ 2.5
Warranty months 24
Thermal conductivity W/(m·K) 4
Product type thermal paste
Weight [g] 25

Package contents

Pactum 1 thermal paste 25 g
Spatula
User manual

Downloads

EY0C002_Pactum-1-25g-EN.d20251001-u080019.zip

Instructions

Pactum 1 25 g (EY0C002)

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