ENDORFY Pactum 4 1.5G EY0C003 Thermal Paste 1.5g Right Top Angle View
ENDORFY Pactum 4 1.5G EY0C003 Thermal Paste 1.5g Right Top Angle View
ENDORFY Pactum 4 1.5G EY0C003 Thermal Paste 1.5g Right Top Angle View

Pactum 4 1.5g Thermal Paste

18,89 zł
18,89 zł
Lowest price in the last 30 days: 18,89 zł

ENDORFY Pactum 4 is a thermal paste designed for the most demanding components. It effectively dissipates heat from modern processors, supporting their stable, long-term operation – even under heavy load.

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You can find the warranty terms HERE.

Cooling Sp. z o.o.
Sokołowska 24
05-806 Sokołów
Poland

SKU: EY0C003

EAN: 5903018666358

ENDORFY Pactum 4 1.5G EY0C003 Thermal Paste 1.5g Right Top Angle View

Key features of the Pactum 4 1.5 g thermal paste

ENDORFY Pactum-4 1,5 EY0C003-Thermal Compounds Thermal Paste Processor
ENDORFY Pactum 4 – szczelne wypełnienie powierzchni kontaktowej procesora
ENDORFY Pactum 4 – pasta termoprzewodząca nałożona na procesor
Aplikacja pasty termoprzewodzącej Endorfy Pactum 4 za pomocą dołączonej łopatki

Effective processor cooling

Keeps high-end processors at safe temperatures even during intensive gaming sessions.

Excellent filling of surface irregularities

Seals microscopic gaps between the IHS and the cooler, ensuring maximum heat transfer and a stable connection.

Simple and quick application

Only a small amount of paste is needed – a single dot or a thin line applied directly to the processor.

Convenient spatula included

Quickly and easily spread the paste over the processor surface using the included spatula.

Discover the capabilities of the Pactum 4 1.5 g

ENDORFY Pactum 4 – pasta termoprzewodząca nałożona na procesor

Effective CPU cooling

Modern processors can generate huge amounts of heat. Pactum 4 efficiently transfers it to the heatsink or radiator, helping keep components within a safe temperature range – even during intensive computations and long gaming sessions. The paste’s formula retains its properties for a long time, providing stable cooling for years and reducing the need for frequent replacement.

ENDORFY Pactum 4 – szczelne wypełnienie powierzchni kontaktowej procesora

Excellent filling of irregularities

The paste precisely fills microscopic gaps between the CPU IHS and the base of air cooling or liquid cooling. It creates a uniform, sealed layer that maximizes heat transfer and allows components to run at full performance. Its formula adheres perfectly to surfaces, remaining stable for a long time. It does not run, does not dry out, and retains its properties even under intensive use.

Aplikacja pasty termoprzewodzącej Endorfy Pactum 4 za pomocą dołączonej łopatki

Simple and quick application

Applying Pactum 4 is extremely intuitive. You only need a small amount of paste – a dot or a thin line – applied directly to the processor. If you care about a perfectly even layer, use the included spatula – the whole process takes a few dozen seconds and doesn’t require experience. After installing the cooler, the paste starts working immediately, providing optimal thermal conditions from the first startup.

Features you'll love about the Pactum 4 1.5 g

Long-lasting thermal performance

Ideal for processors

Excellent filling of surface irregularities

Fast and easy application

Convenient applicator included

1.5 g capacity — enough for more than one installation

Product dimensions for Pactum 4 1.5 g

Technical specification Pactum 4 1.5g Thermal Paste

Technical specifications

Density g/cm³ 2.6
Warranty months 24
Thermal conductivity W/(m·K) 12
Product type thermal paste
Weight [g] 1.5

Package contents

Pactum 4 thermal paste 1.5 g
Spatula
User manual

Downloads

EY0C003_Pactum-4-1.5g-EN.d20251001-u080020.zip

Instructions

Pactum 4 1.5 g (EY0C003)

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